Nanotransfer Printing Using Plasma Etched Silicon Stamps and Mediated by in Situ Deposited Fluoropolymer
Nanotransfer Printing Using Plasma Etched Silicon Stamps and Mediated by in Situ Deposited Fluoropolymer
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DOI：
10.1021/ja201497a
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发表时间：
2011-05-25
影响因子：
15
通讯作者：
Sepaniak, Michael J.
中科院分区：
文献类型：
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作者：
Bhandari, Deepak;Kravchenko, Ivan I.;Sepaniak, Michael J.
本文描述了一种简单的方法，该方法使用八氟环丁烷（OFCB）聚合物薄膜进行高效的纳米级转印（nTP）。OFCB的等离子体聚合产生了一种类似聚四氟乙烯的含氟聚合物，其牢固地粘附并保形地覆盖3-D无机印模。纳米级硅特征上原位沉积的OFCB聚合物的固有低表面能被证明是一种独特的纳米复合材料印模，用于制造各种测试结构，其nTP特征分辨率提高到低于100 nm。
This communication describes a simple method that uses a thin film of octafluorocyclobutane (OFCB) polymer for efficient nanoscale transfer printing (nTP). Plasma polymerization of OFCB produces a Teflon-like fluoropolymer which strongly adheres and conformally covers a 3-D inorganic stamp. The inherently low surface energy of in situ deposited OFCB polymer on nanoscale silicon features is demonstrated as a unique nanocomposite stamp to fabricate various test structures with improved nTP feature resolution down to sub-100 nm.