Experimental Investigation and Optimization of Micro-EDMing Process for Silicon Substrates
Experimental Investigation and Optimization of Micro-EDMing Process for Silicon Substrates
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DOI：
10.1080/10426914.2014.973594
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发表时间：
2015-04
影响因子：
4.8
通讯作者：
V. Tangwarodomnukun;Panida Visonsaya;Nisarat Buranajant;Monchai Opartpunyasarn;C. Dumkum
中科院分区：
文献类型：
--
作者：
V. Tangwarodomnukun;Panida Visonsaya;Nisarat Buranajant;Monchai Opartpunyasarn;C. Dumkum
本研究以n型单晶硅为对象，探讨微电火花加工微沟槽的方法。在实验中改变脉冲宽度、脉冲频率、火花电流和间隙电压。槽的几何形状和粗糙度与材料去除率和电极磨损率一起测量。结果表明，在高能量条件下，可以在高加工率下加工出大而深的槽。然而，这会因此增加电极磨损率，使得该过程效率低下。一个多响应优化，采用灰色关联分析，已被应用。最佳切削结果表明，本研究可获得良好的切削质量、高的材料去除率和低的电极磨损率。
Microelectrical discharge machining of n-type monocrystalline silicon is investigated in this study through a microgrooving process. The pulse duration, pulse frequency, spark current, and gap voltage are varied in the experiments. The groove geometries and roughness are measured together with the material removal rate and electrode wear ratio. The results have shown that a large and deep groove can be made at high machining rate when a high spark energy condition is applied. This can, however, increase the electrode wear ratio as a consequence, making the process inefficient. A multiresponse optimization, using Grey relational analysis, has been applied. The optimum cut result has shown that good cut quality, high material removal rate, and low electrode wear ratio are achievable from this study.