Wetting of T2 Cu by molten 4043 and 6061 Al alloys at 923-1023 K

Wetting of T2 Cu by molten 4043 and 6061 Al alloys at 923-1023 K
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923-1023 K 下熔融的 4043 和 6061 铝合金对 T2 Cu 的润湿

DOI:
10.1016/j.jallcom.2017.11.026
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发表时间:
2018
影响因子:
6.2
通讯作者:
Zhong Weiqiang
Zhong Weiqiang
中科院分区:
材料科学2区
文献类型:
--
作者:
Lin Qiaoli;Li Fuxiang;Jin Peng;Zhong Weiqiang

文献摘要

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用改进的座滴法研究了923-1023 K、高真空下4043和6061铝合金熔体对T2 Cu的润湿。Al/Cu为溶解润湿体系,后期形成金属间化合物。4043 Al和6061 Al中的合金元素对润湿性和界面结构的影响几乎可以忽略。在不同的Al/Cu比范围内,润湿性表现为单调的润湿行为和层状的溶解坑,溶解不是改善润湿性的直接因素。Cu在液相中的扩散可能是影响表观毛细力变化的主要因素。具有金属流体特性的松弛的经验迁移率关系可以很好地拟合润湿行为。
Wetting of T2 Cu by molten 4043 and 6061 Al alloys was studied by the modified sessile drop method at 923–1023 K under high vacuum. Al/Cu is a dissolutive wetting system with intermetallic forming in the latter stage. The alloying elements in both 4043 Al and 6061 Al have almost negligible effect on the wettability and interfacial structures. The monotonous wetting behavior and layered dissolution crater with different range of Al/Cu ratio were found. Dissolution is not a direct factor for improving wettability in this study. The diffusion of Cu in the liquid may contribute mainly to the spreading force that act on the variation of the apparent capillary force. The relaxed empirical mobility relation with specific characteristics of metallic fluid can fit the wetting behavior.