Electron contributions to the heat conduction across Au/graphene/Au interfaces
Electron contributions to the heat conduction across Au/graphene/Au interfaces
复制标题
电子对金/石墨烯/金界面热传导的贡献
DOI：
10.1016/j.carbon.2017.01.051
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发表时间：
2017
期刊：
影响因子：
10.9
通讯作者：
Chen Yunfei
中科院分区：
文献类型：
--
作者：
Zhang Chunwei;Chen Weiyu;Tao Yi;Zhao Weiwei;Cai Shuang;Liu Chenhan;Ni Zhenhua;Xu Dongyan;Wei Zhiyong;Yang Juekuan;Bi Kedong;Chen Yunfei
使用时域热反射 (TDTR) 技术测量 Au/石墨烯/Au 和 Au/氢化石墨烯（H-石墨烯）/Au 界面的热导率。研究发现，石墨烯氢化后，热导率从 30±5MWm−2K−1 降低到 14±3MWm−2K−1。然而，非平衡分子动力学（NEMD）模拟结果表明，如果仅考虑声子作为热能载体，则随着石墨烯的氢化，热导率可降低不超过30%。考虑到实验结果和模拟结果之间的差异，我们推断电子参与了金/石墨烯/金界面的热传导。一旦石墨烯被氢化，电子贡献通道就会关闭。据估计，电子的贡献约占金属/石墨烯/金属界面总界面热导的 53%。
The thermal conductance across Au/graphene/Au and Au/hydrogenated graphene(H-graphene)/Au interfaces are measured using the time domain thermoreflectance (TDTR) technique. It is found that the thermal conductance decreases from 30 ± 5 MWm−2K−1to 14 ± 3 MWm−2K−1when the graphene is hydrogenated. However, nonequilibrium molecular dynamics (NEMD) simulation results show that the thermal conductance can be decreased by no more than 30% as the graphene is hydrogenated if only phonons are considered as the heat energy carriers. Considering the difference between the experimental and simulated results, we infer that electrons are involved in heat conduction across the Au/Graphene/Au interface. Once the graphene is hydrogenated, the electron contribution channel is closed. It is estimated that the contribution from electrons accounts for approximately 53% of the total interfacial thermal conductance for the metal/graphene/metal interfaces.