Quantifying Figures of Merit for Localized Surface Plasmon Resonance Applications: A Materials Survey

Quantifying Figures of Merit for Localized Surface Plasmon Resonance Applications: A Materials Survey
复制标题

DOI:
10.1021/acsphotonics.8b01369
复制
发表时间:
2019-02-01
期刊:
影响因子:
7
通讯作者:
Maier, Stefan A.
Maier, Stefan A.
中科院分区:
物理与天体物理1区
文献类型:
--
作者:
Doiron, Brock;Mota, Monica;Maier, Stefan A.

文献摘要

被引文献

相似文献

利用局域表面等离子体共振(LSPR)将电磁辐射聚焦到纳米尺度,由于光-物质相互作用的强烈增强,在光电器件、医疗和纳米化学方面显示出前所未有的能力。随着我们不断探索新的应用,我们需要一种系统的定量方法来比较不同几何形状和不断增长的材料库的适用性。在这项工作中,我们提出了应用特定的数字构建的基本电子和光学性能的每种材料的优点。我们比较了17种材料,从四个材料类别(贵金属,难熔金属,过渡金属氮化物,导电氧化物)考虑8个局部LSPR应用。我们的品质因数超越了纯粹的电磁效应,并考虑了材料的热特性,与相邻材料的相互作用以及现实的照明条件。对于每个应用程序,我们比较,为简单起见,一个优化的球形天线的几何形状和基准,我们提出的选择对国家的最先进的文献。我们的建议为关键技术应用提供了最合适的等离子体材料,并且可以作为直接从事此类设备设计,制造和测试的人员的起点。
Using localized surface plasmon resonances (LSPR) to focus electromagnetic radiation to the nanoscale shows the promise of unprecedented capabilities in optoelectronic devices, medical treatments and nanoscale chemistry, due to a strong enhancement of light-matter interactions. As we continue to explore novel applications, we require a systematic quantitative method to compare suitability across different geometries and a growing library of materials. In this work, we propose application-specific figures of merit constructed from fundamental electronic and optical properties of each material. We compare 17 materials from four material classes (noble metals, refractory metals, transition metal nitrides, and conductive oxides) considering eight topical LSPR applications. Our figures of merit go beyond purely electromagnetic effects and account for the materials' thermal properties, interactions with adjacent materials, and realistic illumination conditions. For each application we compare, for simplicity, an optimized spherical antenna geometry and benchmark our proposed choice against the state-of-the-art from the literature. Our propositions suggest the most suitable plasmonic materials for key technology applications and can act as a starting point for those working directly on the design, fabrication, and testing of such devices.