A hybrid adhesive bonding of PMMA and PCB with an application on microchip electrophoresis
A hybrid adhesive bonding of PMMA and PCB with an application on microchip electrophoresis
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DOI：
10.1039/c8ay02642d
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发表时间：
2019-03-07
影响因子：
3.1
通讯作者：
You, Hui
中科院分区：
文献类型：
--
作者：
Chang, Yongjia;You, Hui
在微流体的发展中，不同材料的集成变得至关重要，特别是当需要集成流体和电子组件时。在这项工作中，提出了一种混合粘合剂粘接方法结合粘合剂和热粘接。它使用压敏粘合剂（PSA）胶带将聚甲基丙烯酸甲酯（PMMA）膜和印刷电路板（PCB）基板集成，同时PMMA微通道层通过热粘合与PMMA膜粘合。简单的键合工艺可以可靠地集成电子电路和流体元件，而无需任何昂贵的设备。研究了粘接过程中施加的压力与粘接比之间的关系，以及热压过程中压力对剩余通道深度的影响。结合强度也进行了研究与死端通道测试和流量测试范围从20 μ l min（-1）至500 μ l min（-1）。结果表明，使用混合技术在两个不同层之间形成了牢固的结合。作为一个应用，测试了用于电泳检测的微芯片。不同离子的成功分离和迁移时间和峰高的相对标准偏差（RSD）的可比水平意味着键合协议的可靠性和良好的潜力，在未来的广泛应用。
In the development of microfluidics, integration of different materials is becoming critical, especially when the integration of fluidic and electronic components is needed. In this work, a hybrid adhesive bonding method combining adhesive and thermal bonding is proposed. It uses a pressure sensitive adhesive (PSA) tape for integration of a polymethyl methacrylate (PMMA) film and printed circuit board (PCB) substrate while a PMMA microchannel layer is bonded with PMMA film through thermal bonding. The simple bonding process can reliably integrate electronic circuits and fluidic components without any expensive equipment. The relationship between pressure applied during adhesive bonding and the bond ratio is investigated as well as the influence of pressure upon the remaining channel depth during thermocompression. The bond strength is also studied with a dead-end channel test and flow rate test ranging from 20 mu l min(-1) to 500 mu l min(-1). The results demonstrate a strong bond formed between the two different layers using the hybrid technique. As an application, a microchip for electrophoresis detection is tested. Successful separation of different ions and a comparable level of the relative standard deviation (RSD) for the migration time and the peak height imply the reliability of the bonding protocol and the good potential for a wide range of applications in the future.