Use of titanates to achieve a temperature-stable low-temperature cofired ceramic dielectric for wireless applications

Use of titanates to achieve a temperature-stable low-temperature cofired ceramic dielectric for wireless applications
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DOI:
10.1111/j.1151-2916.2002.tb00179.x
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发表时间:
2004-12
影响因子:
3.9
通讯作者:
S. Dai;Rong-Fong Huang;D. Wilcox
S. Dai;Rong-Fong Huang;D. Wilcox
中科院分区:
材料科学2区
文献类型:
--
作者:
S. Dai;Rong-Fong Huang;D. Wilcox

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针对便携式消费无线设备应用,研制了一种低损耗、近零温度系数的谐振频率(Tf)低温共烧陶瓷(LTCC)主体介质。低Tf是通过在起始配方中添加负介电常数温度系数(Te)的二氧化钛对填充氧化铝玻璃介质进行补偿而实现的。X射线衍射结果表明,初始配方中的部分二氧化钛溶解到玻璃中,并通过成核和生长机制观察到大量的结晶钛化合物的形成。二氧化钛在玻璃中的溶解和随后钛化合物的形成被认为导致在最终的烧结结构中获得接近零的Tf所需的相对少量的二氧化钛。
A low-loss and near-zero temperature coefficient of resonant frequency (T f ) low-temperature cofired ceramic (LTCC) host dielectric was developed for portable consumer wireless device applications. The low T f was realized by compensating the Al 2 O 3 -filled-glass dielectric with admixtures of TiO 2 (negative temperature coefficient of dielectric constant (T e )) in the starting formulation. XRD data indicated a portion of the TiO 2 in the starting formulation dissolved into the glass, and extensive formation of crystalline titanium compounds was observed via a nucleation and growth mechanism. The dissolution of TiO 2 in the glass and subsequent formation of titanium compounds was believed to result in the relatively small amount of TiO 2 required to achieve a near-zero T f in the final sintered structure.