Residual stress measurement using the hole drilling method and laser speckle interferometry: Part I
Residual stress measurement using the hole drilling method and laser speckle interferometry: Part I
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DOI：
10.1111/j.1747-1567.2003.tb00114.x
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发表时间：
2003-05-01
影响因子：
1.6
通讯作者：
Ponslet, E
中科院分区：
文献类型：
--
作者：
Steinzig, M;Ponslet, E
我们在这个由四部分组成的系列中的目的是描述散斑干涉技术在残余应力测量中的应用。这项技术依赖于在感兴趣的部分钻一个小孔，测量产生的变形，并利用这个结果来计算残余应力。在本系列的第一部分中，我们简要介绍了残余应力问题和钻孔测量技术，并概述了用于测量变形的电子散斑干涉仪(ESPI)系统。在第二部分中，将讨论一种利用所有可用数据的新分析技术，并与其他利用更本地化的技术的技术进行比较，该技术有时会以标题为“技术应用”的短篇行业/应用文章为特色。这些短文展示了测量技术和仪器的实际应用，主要用于工业，在某些情况下，还用于课堂。本月，我们将重点介绍两项技术应用-
Our purpose in this 4-part series is to describe an application of speckle pattern interferometry to the measurement of residual stress. The technique relies on drilling a small hole in the part of interest, measuring the resultant deformation and using this result to calculate the residual stress. In this first part of the series, we give a brief introduction to residual stress issues and hole-drilling measurement techniques, and a summary of the electronic speckle pattern interferometer (ESPI) system that is used to measure the deformation. In part 2, a new analysis technique that makes use of all available data will be discussed, and compared to other techniques that utilize more localizedET occasionally features short Industry/Application articles under the title,‘‘Technology Applications.’’The short articles demonstrate real world application of both measurement techniques and apparatus to be used primarily in industry and, in some cases, the classroom. This month we are featuring two Technology Applica-