Comparative study on slow-state near interface hole traps in NO and Ar annealed N-type 4H-SiC MOS capacitors by ultraviolet light
Comparative study on slow-state near interface hole traps in NO and Ar annealed N-type 4H-SiC MOS capacitors by ultraviolet light
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DOI:
10.1007/s10854-018-9563-5
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发表时间:
2018-07
期刊:
影响因子:
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通讯作者:
Yifan Jia;Hongliang Lv;Xiaoyan Tang;Qingwen Song;Yimen Zhang;Yuming Zhang;S. Dimitrijev;Jisheng Han
中科院分区:
文献类型:
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作者:
Yifan Jia;Hongliang Lv;Xiaoyan Tang;Qingwen Song;Yimen Zhang;Yuming Zhang;S. Dimitrijev;Jisheng Han
The characteristics of near interface charge trapping and releasing on n-type 4H-SiC MOS capacitors with NO and Ar passivation have been systematically investigated through time-dependent bias stress with ultraviolet light irradiation. Flat band voltage instability of the Ar annealed samples mainly results from electrons directly tunneling in and out of the near interface electron traps. However, hole trapping by the near interface hole traps (NIHTs) also need to be concerned for the NO annealed samples. It is found that part of the trapped holes cannot be easily released from the slow-state NIHTs, which may act as the positive fixed charge and induce the unrecoverable negative shift of threshold voltage. The results from XPS show that after the NO annealing, some of the intermediate oxidation states are converted to the strong Si≡N and Si–Ox–Nybonds located in the transition layer, which may act as NIHTs and even suppress hydrofluoric acid etching. Thus, it is important to optimize nitrogen treatment in order to reduce the density of NIHTs induced in the 4H-SiC MOS devices.