Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen‐Free Copper Wires
Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen‐Free Copper Wires
复制标题
DOI：
10.1002/adem.202200037
复制
发表时间：
2022-03
影响因子：
3.6
通讯作者：
Pengfei Sun;Zhiwei Li;J. Hou;A. Xu;Qiang Wang;Yi Zhang;Zhenjun Zhang;Penglin Zhang;Zhe-Feng Zhang
中科院分区：
文献类型：
--
作者：
Pengfei Sun;Zhiwei Li;J. Hou;A. Xu;Qiang Wang;Yi Zhang;Zhenjun Zhang;Penglin Zhang;Zhe-Feng Zhang
在电力传输过程中，铜线中的缺陷与电子相互作用，产生热效应，从而引起铜线的组织和性能变化。在此，研究了在不同温度下退火的无氧铜线材的微观结构、强度和电导率的演变。此外，定量地揭示了各种微观结构对强度和导电性的影响。在低温区（80-150 °C），位错回复是强度下降的主要原因;而电导率的提高主要是由于位错密度的降低和晶界由非平衡态向平衡态的转变。在高温区（210 °C以上），强度损失主要与再结晶晶粒尺寸增大和再结晶区位错消失有关。电导率的提高主要归因于晶界密度的显著降低和位错的进一步回复。
In the process of electric power transmission, the defects in the copper wire interact with the electrons which results in a thermal effect, accordingly, causing the changes of microstructure and properties of the copper wire. Herein, the evolution of microstructure, strength, and electrical conductivity of the oxygen‐free copper wires annealed at different temperatures is investigated. In addition, the effects of various microstructures on strength and electrical conductivity are quantitatively revealed. In the low‐temperature region (80–150 °C), dislocation recovery is the main reason for the decrease in strength; while, the increase in electrical conductivity is mainly due to the decrease in dislocation density and the transformation of grain boundary from nonequilibrium state to equilibrium state. In the high‐temperature region (above 210 °C), the strength loss is mainly related to the increasing recrystallized grain size and the disappearance of dislocations in the recrystallized region. The increase in electrical conductivity is mainly attributed to the significant decrease in grain boundary density and the further recovery of dislocations.