Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process
Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process
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超声波楔-楔键合过程中氧化物去除机理的研究
DOI：
10.1109/eptc.2016.7861512
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发表时间：
2016
期刊：
影响因子：
--
通讯作者：
J. Twiefel
中科院分区：
文献类型：
--
作者：
Y. Long;F. Dencker;F. Schneider;B. Emde;Chun Li;J. Hermsdorf;M. Wurz;J. Twiefel
作为铝或铜材料超声键合过程中不可避免的步骤，去除阻碍键合形成的氧化物对于获得高质量至关重要。然而，经过几十年的应用，超声波焊接的氧化物去除过程仍然不清楚。在这个项目中，去除机制进行了研究，通过分析人工涂层的氧化层。通过高速观察系统实时观察氧化物去除过程，并在电子显微镜下观察键合过程后的氧化物分布。结果表明，在键合过程中，分离的氧化物首先聚集成较大的颗粒，然后被挤压到接触区域之外。对颗粒的面积进行计数并拟合对数正态分布。
As an inevitable step during ultrasonic bonding of aluminum or copper materials, the removal of oxides that prevent the bond formation is essential for obtaining high quality. Nevertheless, the oxides removal process is still unclear after tens of years' application of ultrasonic bonding. In this project, the removal mechanism was investigated via the analysis of an artificially coated oxide layer. The oxide removal process was observed in real-time by a high-speed observation system and the oxides distribution after the bonding process was observed under an electron microscope. The results show that during the bonding process, the detached oxides first agglomerate into larger particles and were then pressed outside of the contact area. The areas of the particles were counted and fit to a lognormal distribution.