Inhibiting creep in nanograined alloys with stable grain boundary networks
Inhibiting creep in nanograined alloys with stable grain boundary networks
复制标题
通过稳定的晶界网络抑制纳米晶合金的蠕变
DOI:
10.1126/science.abq7739
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发表时间:
2022-11
期刊:
影响因子:
56.9
通讯作者:
K. Lu
中科院分区:
文献类型:
--
作者:
B.B. Zhang;Y.G. Tang;Q.S. Mei;X.Y. Li;K. Lu
Creep, the time-dependent deformation of materials stressed below the yield strength, is responsible for a great number of component failures at high temperatures. Because grain boundaries (GBs) in materials usually facilitate diffusional processes in creep, eliminating GBs is a primary approach to resisting high-temperature creep in metals, such as in single-crystal superalloy turbo blades. We report a different strategy to inhibiting creep by use of stable GB networks. Plastic deformation triggered structural relaxation of high-density GBs in nanograined single-phased nickel-cobalt-chromium alloys, forming networks of stable GBs interlocked with abundant twin boundaries. The stable GB networks effectively inhibit diffusional creep processes at high temperatures. We obtained an unprecedented creep resistance, with creep rates of ~10–7 per second under gigapascal stress at 700°C (~61% melting point), outperforming that of conventional superalloys. Description Getting rid of the creep Materials can plastically deform by creep, which is amplified at higher temperatures. Avoiding creep often requires making large single crystals of an alloy, which is expensive and time consuming. Zhang et al. show that introducing a stable grain boundary network into a nanograined medium-entropy alloy also improves the creep behavior at high temperature. The resulting alloy has high creep resistance even under high stresses, a important property in structural alloys. —BG Introducing a stable grain boundary network improves the creep behavior of a medium-entropy alloy.
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DOI:
10.1002/9781118603031
发表时间:
2011-11
期刊:
--
影响因子:
--
作者:
L. Priester
通讯作者:
L. Priester
影响因子:
4.7
作者:
G. Han;J. J. Yu-J.;Zushu Hu;X. Sun
通讯作者:
G. Han;J. J. Yu-J.;Zushu Hu;X. Sun
影响因子:
3.6
作者:
J. Weissmüller;J. Markmann
通讯作者:
J. Weissmüller;J. Markmann
影响因子:
56.9
作者:
Zhou, X.;Li, X. Y.;Lu, K.
通讯作者:
Lu, K.
影响因子:
64.8
作者:
Darling, K. A.;Rajagopalan, M.;Solanki, K. N.
通讯作者:
Solanki, K. N.