Barbed spike arrays for mechanical chip attachment
Barbed spike arrays for mechanical chip attachment
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用于机械芯片附着的倒刺钉阵列
DOI：
10.1109/memsys.2001.906475
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发表时间：
2001
期刊：
影响因子：
--
通讯作者：
G. Stemme
中科院分区：
文献类型：
--
作者：
P. Griss;P. Enoksson;G. Stemme
我们制造并测试了两种类型的微结构，用于将芯片机械附着到软表面。微结构是使用DRIE（深反应离子蚀刻）在硅中蚀刻的倒刺钉。在非生物材料（聚乙烯箔、铝箔和Parafilm/sup TM/）以及人体皮肤上测量了两种类型倒刺穿刺器阵列的机械附着。最大粘附力为1.36 N，通过2/spl times/2 mm/sup 2/芯片实现，芯片包含压在聚乙烯箔中的64个带倒钩的钉。皮肤中的最大粘附力为0.54 N。两种不同倒钩类型的形状对非生物材料的解脱力有显著影响。
We fabricated and tested two types of microstructures for the mechanical attachment of chips to soft surfaces. The microstructures are barbed spikes etched in silicon using DRIE (Deep Reactive Ion Etching). The mechanical attachment of two types of barbed spike arrays was measured on nonbiological materials (Polyethylene foil, Aluminium foil and Parafilm/sup TM/) as well as on human skin. The maximum adhesion force was 1,36 N achieved by a 2/spl times/2 mm/sup 2/ chip containing 64 barbed spikes pressed in Polyethylene foil. Maximum adhesion in skin was 0,54 N. The shape of the two different barb types has significant influence on the detachment forces for nonbiological materials.