The fast formation of Cu-Sn intermetallic compound in Cu/Sn/Cu system by induction heating process
The fast formation of Cu-Sn intermetallic compound in Cu/Sn/Cu system by induction heating process
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DOI：
10.1016/j.matlet.2017.12.102
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发表时间：
2018-03-15
影响因子：
3
通讯作者：
Guo, Mengjiao
中科院分区：
文献类型：
--
作者：
Yin, Zuozhu;Sun, Fenglian;Guo, Mengjiao
在Cu/Sn（10 μ m）/Cu焊点中的Cu 3Sn的快速形成通过感应加热过程在几分钟内和在0.01 MPa的低压下在环境温度下进行了研究。感应加热工艺的引入有利于促进液态Sn/固态Cu金属化界面的界面反应。从不同连接时间界面IMC的三维显微结构观察，在焊接初期，Cu与Cu 6Sn 5之间形成了扇贝状的Cu 6Sn 5，而Cu与Cu 6Sn 5之间形成了平面状的Cu 3Sn。之后，扇贝状的Cu 6Sn 5生长过渡到树枝状的形态，而平面状的Cu 3Sn生长过渡到柱状的形态，直到最终形成完整的Cu 3Sn焊点。随着Cu原子在Sn熔体中的运动，成分过冷形成了柱状Cu 3Sn化合物和树枝状Cu 6Sn 5化合物的复合形貌。焦耳热效应和电磁搅拌效应共同导致界面金属间化合物的快速微观结构演变。(C)2017爱思唯尔B. V.保留所有权利。
The fast formation of Cu3Sn in a Cu/Sn(10 mu m)/Cu solder joints were investigated by induction heating process in a few minutes and under a low pressure of 0.01 MPa at ambient temperature. The introducing of induction heating process showed benefit effects on enhancing the interfacial reaction at the liquid Sn/solid Cu metallization interface. From the three-dimensional microstructural observation of interfacial IMCs at different bonding times, scallop-liked Cu6Sn5 was formed while planar-liked Cu3Sn was formed between Cu and Cu6Sn5 at initial soldering stage. After that, the scallop-liked Cu6Sn5 grew with a transition to dendritic-liked morphology while planar-liked Cu3Sn grew with a transition to columnar-liked morphology until the full Cu3Sn solder joint was eventually formed. Accompanying with the movement of Cu atoms in the molten Sn, the morphology of columnar-liked Cu3Sn compounds surrounded by dendritic-liked Cu6Sn5 compounds was formed due to constitutional super-cooling. The rapid microstructure evolution of the interfacial IMCs was caused by the joule heating effect as well as the electromagnetic stirring effect. (C) 2017 Elsevier B.V. All rights reserved.