A kinetic study of the chemical vapor deposition of silicon carbide from dichlorodimethylsilane precursors
A kinetic study of the chemical vapor deposition of silicon carbide from dichlorodimethylsilane precursors
复制标题
二氯二甲基硅烷前驱体化学气相沉积碳化硅的动力学研究
DOI:
10.1149/1.1838451
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发表时间:
1998
期刊:
影响因子:
--
通讯作者:
H. Komiyama
中科院分区:
文献类型:
--
作者:
T. Takeuchi;Y. Egashira;T. Osawa;H. Komiyama
Silicon carbide (SiC) films were prepared from dichlorodimethylsilane (DDS) precursors at temperatures ranging from 1173 to 1373 K by atmospheric pressure chemical vapor deposition (APCVD). A comprehensive model of the chemical vapor deposition of SiC from DDS was developed, which includes gas-to-surface mass transfer, surface sticking, and gas-phase chemistry. This model successfully reproduced our experimental results as well as those previously reported in the literature. This model assumed that the gas-phase chemistry consists of two reaction paths to form SiC: (i) gas-phase decomposition of DDS to form a growth species, most plausibly initiated by the fission reaction of the Si-C bond in DDS, followed by sticking on the surface and (ii) polymerization between this growth species and DDS, followed by deposition on the surface. The relative importance of mass transfer relative to chemical reactions in the gas phase was also determined.