Formation of ternary Mg-Cu-Dy bulk metallic glasses

Formation of ternary Mg-Cu-Dy bulk metallic glasses
复制标题

三元Mg-Cu-Dy块体金属玻璃的形成

DOI:
10.1007/s12034-011-0351-6
复制
发表时间:
2011-12
影响因子:
1.8
通讯作者:
Meng, L. K.
Meng, L. K.
中科院分区:
材料科学4区
文献类型:
--
作者:
Wu, X. F.;Kang, Y.;Wu, F. F.;Qiu, K. Q.;Meng, L. K.

文献摘要

参考文献

相似文献

采用差示扫描量热法(DSC)和x射线衍射(XRD)技术系统研究了Mg-Cu-Dy三元合金的玻璃形成能力(GFA)。结果表明:采用常规铸型方法,在该体系中成功制备了直径为4 ~ 8 mm的Mg-Cu-Dy三元大块金属玻璃(BGMs);Mg55Cu32Dy13、Mg60Cu27Dy13、mg65cu25dy10和mg70cu17dy13bmg表现出明显的玻璃化转变、广阔的过冷区和不同的结晶和熔化行为。它们的过冷液区(ΔTx)从41 K降至65 K,玻璃化转变温度(Trg)从0·5363降至0·5974,γ参数从0·4038降至0·4136。γ值与bgm的GFA值具有较好的一致性。另一方面,Mg60Cu27Dy13BMG获得了624 MPa的高断裂抗压强度。
The glass-forming ability (GFA) of ternary Mg-Cu-Dy alloys was systematically investigated by using differential scanning calorimetry (DSC) and X-ray diffractometry (XRD) techniques. The results showed that a series of ternary Mg-Cu-Dy bulk metallic glasses (BGMs) with a diameter of 4–8 mm were successfully fabricated in the system with conventional Cu-mold casting method. Mg55Cu32Dy13, Mg60Cu27Dy13, Mg65Cu25Dy10and Mg70Cu17Dy13BMGs exhibit a clear glass transition, a broad supercooled liquid region and different crystallization and melting behaviours. They have supercooled liquid region (ΔTx) from 41 K to 65 K, reduced glass transition temperature (Trg) from 0·5363 to 0·5974 andγparameter from 0·4038 to 0·4136. Theγshows a relatively good agreement with the GFA of the BGMs. On the other hand, a high fracture compressive strength of 624 MPa was obtained for Mg60Cu27Dy13BMG.
DOI: 10.1016/s1359-6454(01)00181-1
发表时间: 2001-08-16
期刊: ACTA MATERIALIA
影响因子: 9.4
作者:
Inoue, A;Zhang, W;Kurosaka, K
通讯作者: Kurosaka, K
DOI: 10.4028/www.scientific.net/msf.269-272.855
发表时间: 1998-01
期刊: Materials Science Forum
影响因子: --
作者:
A. Inoue;T. Zhang;A. Takeuchi
通讯作者: A. Inoue;T. Zhang;A. Takeuchi
DOI: 10.1016/j.surfcoat.2007.09.028
发表时间: 2008-03-15
影响因子: 5.4
作者:
Basu, A.;Sarnant, A. N.;Dahotre, Narendra B.
通讯作者: Dahotre, Narendra B.
DOI: 10.1016/j.msea.2008.04.036
发表时间: 2008-09
影响因子: 6.4
作者:
Qiuyang Li;K. Qiu;X. Yang;Y. Ren;X. Yuan;T. Zhang
通讯作者: Qiuyang Li;K. Qiu;X. Yang;Y. Ren;X. Yuan;T. Zhang
DOI: 10.1016/s1359-6454(02)00166-0
发表时间: 2002-08-01
期刊: ACTA MATERIALIA
影响因子: 9.4
作者:
Lu, ZP;Liu, CT
通讯作者: Liu, CT