Dynamic microscopy of nanoscale cluster growth at the solid-liquid interface
Dynamic microscopy of nanoscale cluster growth at the solid-liquid interface
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DOI：
10.1038/nmat944
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发表时间：
2003-08-01
期刊：
影响因子：
41.2
通讯作者：
Ross, FM
中科院分区：
文献类型：
--
作者：
Williamson, MJ;Tromp, RM;Ross, FM
固-液界面的动态过程在广泛的科学和技术领域中具有关键的重要性。例如，铜的电化学沉积用于集成电路的金属化，详细了解成核、生长和结合对于优化最终的微结构至关重要。在过去的十年里，由于实时、高分辨率成像技术的常规可用，我们对固体-蒸汽界面的过程的理解有了极大的进步，这些成像技术产生的数据可以与理论进行定量比较。然而，研究固-液界面的困难使我们对那里的过程的了解不够完整。在这里，我们分析了在电沉积过程中纳米级铜团簇的形核和生长的动态观测--在使用一种新的透射电子显微镜技术的情况下记录的。我们实时跟踪单个星团的演变，并将它们的发展与包含早期生长阶段电沉积的基本物理的模拟进行比较。本文发展的实验技术适用于固-液界面的多种动力学现象。
Dynamic processes at the solid–liquid interface are of key importance across broad areas of science and technology. Electrochemical deposition of copper, for example, is used for metallization in integrated circuits, and a detailed understanding of nucleation, growth and coalescence is essential in optimizing the final microstructure. Our understanding of processes at the solid–vapour interface has advanced tremendously over the past decade due to the routine availability of real-time, high-resolution imaging techniques yielding data that can be compared quantitatively with theory,,. However, the difficulty of studying the solid–liquid interface leaves our understanding of processes there less complete. Here we analyse dynamic observations—recordedin situusing a novel transmission electron microscopy technique—of the nucleation and growth of nanoscale copper clusters during electrodeposition. We follow in real time the evolution of individual clusters, and compare their development with simulations incorporating the basic physics of electrodeposition during the early stages of growth. The experimental technique developed here is applicable to a broad range of dynamic phenomena at the solid–liquid interface.