Effects of Post-Plating Reflow on Changes in Crystal Grain Size of Sn-2 mass%Bi Alloy Plating with Thermal Cycling Treatment
Effects of Post-Plating Reflow on Changes in Crystal Grain Size of Sn-2 mass%Bi Alloy Plating with Thermal Cycling Treatment
复制标题
效果%20of%20电镀后%20回流%20on%20变化%20in%20晶体%20颗粒%20尺寸%20of%20Sn-2%20质量%Bi%20合金%20电镀%20与%20热%20循环%20处理
DOI：
10.2320/matertrans.mj201021
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发表时间：
2010
影响因子：
1.2
通讯作者：
H. Sosiati
中科院分区：
文献类型：
--
作者：
N. Kuwano;Atsushi Jinnouchi;S. Horikami;N. Hirokado;H. Sosiati
研究了Fe-42Ni基体上电镀Sn-2质量%Bi层的热循环处理对锡（Sn）晶体晶粒尺寸的影响，以阐明镀后回流的影响。采用扫描电镜（SEM）和扫描离子显微镜（SIM）观察镀层表面形貌，采用电子束背散射衍射（EBSD）观察sn晶粒。并用透射电子显微镜（TEM）分析了晶须形成的微观组织。结果表明：在初始镀态、回流处理和1500次热循环处理后，Sn- bi试样中的Sn晶粒均小于纯Sn试样。在未回流处理的Sn-Bi试样上，经过100次热循环处理后形成了较短的晶须，而经过500次热循环处理后形成了较长的晶须。晶粒尺寸在回流处理后和热循环初期均暂时增大，但随着热循环处理的进行逐渐减小。这种现象可以用热循环处理的“变形和再结晶”效应来解释。
Changes in the grain size of tin (Sn) crystals associated with a thermal cycling treatment were investigated for layers of Sn-2 mass%Bi electroplated on Fe-42Ni substrates in order to clarify the effects of post-plating reflow. Morphology of plated surface was observed by scanning electron microscopy (SEM) and scanning ion microscopy (SIM), and the Sn-grains were observed by electron beam back scattered diffraction (EBSD). Microstructures were also analyzed with a transmission electron microscope (TEM) in order to investigate the process of whisker formation. It was found that the Sn grains in Sn-Bi specimen are smaller than those in pure Sn specimen at the initial state of as-plating, after the reflow treatment and after the thermal cycling treatment of 1500 cycles. On the Sn-Bi specimen without a reflow treatment, short whiskers had grown after 100 cycles of thermal cycling treatment, but on those with the reflow treatment, relatively-long whiskers were formed after 500 cycles. The grain sizes increase temporarily after the reflow treatment and also after the very early stage of thermal cycling treatment, but gradually decreased with the thermal cycling treatment. The phenomenon is explained by the "deformation and recrystallization" effects of the thermal cycling treatment.
热循环过程中铝/氮化铝界面的断裂过程，Yoshiyuki Nagatomo、Ryo Muranaka、Hiromasa Hayashi
DOI：
--
发表时间：
2009
期刊：
影响因子：
--
作者：
赤木和夫(監修;分担執筆);Yoshirou Kuromitsu and Noriyuki Kuwano
通讯作者：
Yoshirou Kuromitsu and Noriyuki Kuwano