Thermal resistance in dependence of diode laser packages
Thermal resistance in dependence of diode laser packages
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DOI：
10.1117/12.764676
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发表时间：
2008-02
期刊：
影响因子：
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通讯作者：
M. Leers;K. Boucke;M. Götz;A. Meyer;M. Kelemen;Nico Lehmann;F. Monti di Sopra
中科院分区：
文献类型：
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作者：
M. Leers;K. Boucke;M. Götz;A. Meyer;M. Kelemen;Nico Lehmann;F. Monti di Sopra
高功率二极管激光棒需要具有高冷却效率和长期稳定性的封装。由于二极管激光器条的输出功率不断增加，封装的热阻变得更加重要。它是关于封装尤其是散热器冷却效率的关键信息。除了散热器之外，热阻还取决于焊料界面、封装工艺和条结构，例如填充因子和谐振器长度。这项工作提出了不同的封装类型和激光棒设计的热比较。不同的封装类型进行了实验测量和分析，通过数值计算，以获得有关不同参数的影响的信息：传导冷却和水冷铜散热器以及一种新型的膨胀匹配的微通道热沉的Cu-AlN三明治进行了研究。除了不同的封装，激光棒与不同的谐振腔长度安装和分析其热行为;的热阻对谐振腔长度的依赖性是一个特别感兴趣的调查。在平行的实验热模拟相同的封装和激光棒的几何形状进行。模拟中选择的边界条件与实验值相当，并且改变相同的参数。理论和实验结果之间的关系。分析显示了影响因素，以便为特定应用选择最佳包装。
High power diode laser bars require packages with a high cooling efficiency and long-term stability. Due to the increasing output power of the diode laser bars the thermal resistance of the packaging becomes even more important. It is the key information about the cooling efficiency of a package and in particular of the heat sink. Besides the heat sink the thermal resistance depends also on the solder interface, packaging process, and bar structure such as fill factor and resonator length. This work presents a thermal comparison of different packaging types and laser bar designs. Different package types are experimentally measured and analyzed by numerical calculations to obtain information about the influence of the different parameters: Conductively cooled and water cooled copper heat sinks as well as a new type of expansion matched micro-channel heat sink made out of Cu-AlN sandwich are investigated. In addition to the different packages, laser bars with different resonator lengths are mounted and analyzed regarding their thermal behavior; the dependency of the thermal resistance on the resonator length is a particular interest of the investigation. In parallel to the experiments thermal simulations of the same packages and laser bar geometries are performed. The boundary conditions chosen in the simulations are comparable to the experimental values and the same parameters are varied. The relations between theoretical and experimental results are presented. The analysis shows the influencing factors, so that the optimum package can be chosen for a specific application.