Stabilization of Nano-Al2O3p/Cu Composite after High Temperature Annealing Treatment
Stabilization of Nano-Al2O3p/Cu Composite after High Temperature Annealing Treatment
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DOI：
10.4028/www.scientific.net/msf.475-479.993
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发表时间：
2005-01
期刊：
影响因子：
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通讯作者：
K. Song;Ping Liu;B. Tian;Q. Dong;J. Xing
中科院分区：
文献类型：
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作者：
K. Song;Ping Liu;B. Tian;Q. Dong;J. Xing
Al2O3 dispersion strengthened copper composite (Al2O3p/Cu composite) was produced by internal oxidation. The hardness and electrical conductivity of the produced Al2O3p/Cu composite (0.60 wt.% Al2O3) subjected to high temperature annealing treatments after different cold work deformations have been investigated; the microstructures of the composite have also been analyzed by TEM. Results show that the microstructure of the composite is characterized by an uniform distribution of nano-Al2O3 particles in Cu-matrix; the composite can maintain more than 91% hardness retention after 1h, 1000°C annealing treatment; the recrystallization of the Cu-matrix can be largely retarded and only partially happened even annealing for 1h at 1050°C, following cold deformation of 84%.
