Application and analysis of thermosensitive parameters in the case of hybrid power modules
Application and analysis of thermosensitive parameters in the case of hybrid power modules
复制标题
混合功率模块热敏参数的应用与分析
DOI：
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发表时间：
1994
期刊：
影响因子：
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通讯作者：
R. Perret
中科院分区：
文献类型：
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作者：
E. Farjah;R. Perret
本文讨论了在混合模块中预测结温时热敏参数的实现和局限性，并为此提出了一些补救措施。通过应用IGBT的两个重要热敏参数得到的结果表明，由这些参数预测的等效温度不是单个芯片温度的简单平均值，而是相当接近最热的温度。给出了不同试验的结果，并说明了使用这些参数的一般方法（温度敏感参数法）。<<ETX>>
In this paper, implementation and limitation of thermosensitive parameters when predicting junction temperature in a hybrid module is discussed and some remedies are presented for this purpose. The results obtained by applying two important thermosensitive parameters of an IGBT show that equivalent temperature predicted by these parameters is not a simple average of individual chip temperature but is rather near to the hottest one. The results of different tests are presented and a generalized method (temperature sensitive parameter method) for using these parameters is explained.<<ETX>>