10.4 A Wheatstone Bridge Temperature Sensor with a Resolution FoM of 20fJ.K2
10.4 A Wheatstone Bridge Temperature Sensor with a Resolution FoM of 20fJ.K2
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10.4 分辨率 FoM 为 20fJ.K2 的惠斯登电桥温度传感器
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发表时间：
2019
期刊：
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通讯作者：
K. Makinwa
中科院分区：
文献类型：
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作者：
S. Pan;K. Makinwa
用于嵌入式应用的温度传感器应该是节能和面积高效的。惠斯通电桥（WhB）传感器和连续时间ADC的组合已被证明具有高能效[1]，[2]。然而，它们的面积$（gt 0.25$ $mm^{2}）$仍然大于可比较的基于BJT的传感器的面积[3]，[4]。本文介绍了一种温度传感器，它使用FIR-DAC ADC来减小其面积并提高能效，两者均为2美元 与最先进的技术相比[5]。
Temperature sensors intended for embedded applications should be both energy-and area-efficient. The combination of Wheatstone-bridge (WhB) sensors and continuous-time ADCs has proven to be highly energy efficient [1], [2]. However, their area $(gt 0.25$ $mm^{2})$ is still larger than that of comparable BJT-based sensors [3], [4]. This paper presents a temperature sensor that uses an FIR-DAC ADC to reduce its area and increase energy-efficiency, both by $2 imes $ compared to the stateof-the-art [5].