A novel flip-chip interconnection technique using solder bumps for high-speed photoreceivers
A novel flip-chip interconnection technique using solder bumps for high-speed photoreceivers
复制标题
一种用于高速光接收器的新型倒装芯片互连技术，使用焊料凸块
DOI：
10.1109/50.59160
复制
发表时间：
1990
期刊：
影响因子：
--
通讯作者：
K. Iwashita
中科院分区：
文献类型：
--
作者：
K. Katsura;T. Hayashi;F. Ohira;S. Hata;K. Iwashita
描述了一种用于高速宽带光接收器的倒装芯片互连技术，该技术使用小焊点代替传统的引线键合。该技术实现了低寄生元件的互连，不损坏器件，易于组装。介绍了一种由宽带p-i-n光电二极管和激光速度的砷化镓金属半导体场效应晶体管(MESFET)前置放大器组成的光接收器，该前置放大器采用直径约26微米的焊料凸点连接，在1.55微米处的频率响应大于22 GHz。这证实了焊料凸点互连技术在未来高速宽带光模块中的有效性。>；
A flip-chip interconnection technique using small solder bumps instead of conventional wire bonding for high-speed broadband photoreceivers is described. The technique achieves interconnection with low parasitic elements, no damage to devices, and easy assembly. A photoreceiver composed of a broadband p-i-n photodiode and a laser-speed GaAS metal-semiconductor field-effect transistor (MESFET) preamplifier connected using solder bumps that are about 26 mu m in diameter, with a frequency response of over 22 GHz at 1.55 mu m, is demonstrated. This confirms the effectiveness of the solder bump interconnection technique for future high-speed broadband optical modules. >