Effects of Pad Array Dimensions and Misalignment Offsets on Optimal Fraction of Conductive Particles in Anisotropic Conductive Film Packages
Effects of Pad Array Dimensions and Misalignment Offsets on Optimal Fraction of Conductive Particles in Anisotropic Conductive Film Packages
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焊盘阵列尺寸和错位偏移对各向异性导电膜封装中导电颗粒最佳比例的影响
DOI：
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发表时间：
2013
影响因子：
2
通讯作者：
Chao‐Ming Lin
中科院分区：
文献类型：
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作者：
Chao‐Ming Lin
各向异性导电膜（ACF）封装的失效概率主要取决于粘合剂树脂中导电颗粒的体积分数。在这项研究中，V形曲线的方法是用来确定导电颗粒的最佳体积分数作为键合的几何参数，焊盘阵列的尺寸，和上下焊盘之间的错位偏移的函数。在评估ACF封装的相应失效概率时，根据泊松函数模型确定开口失效的概率，而使用箱模型导出桥接失效的概率。在计算的开放和桥接概率，这两个模型进行修改，以考虑到封装错位对相对焊盘之间的有效导电面积和相邻对相对焊盘之间的桥接路径长度的影响，分别。然后结合使用概率理论的开放和桥接概率，以建立ACF封装的整体故障概率。结果表明，对于给定的键合几何参数和未对准偏移量，随着焊盘阵列尺寸的增加，导电颗粒的最佳体积分数近似保持不变。然而，对于给定的键合几何参数和焊盘阵列尺寸，导电颗粒的最佳体积分数随着失调误差的增加而增加。总体而言，结果表明，对于任何给定值的键合几何参数，焊盘阵列尺寸，和未对准偏移，ACF封装的故障概率可以最小化，通过设置导电颗粒的体积分数等于对应于V形曲线的尖端的值。
The failure probability of anisotropic conductive film (ACF) packages is critically dependent on the volume fraction of conductive particles within the adhesive resin. In this study, the V-shaped curve method is used to determine the optimal volume fraction of conductive particles as a function of the bonding geometric parameters, the pad array dimension, and the misalignment offset between the upper and lower pads. In evaluating the corresponding failure probability of the ACF package, the probability of an opening failure is determined in accordance with a Poisson function model, while the probability of a bridging failure is derived using a box model. In computing the opening and bridging probabilities, the two models are modified to take account of the effects of package misalignments on the effective conductive area between opposing pads and the bridging path length between neighboring pairs of opposing pads, respectively. The opening and bridging probabilities are then combined using probability theory to establish the overall failure probability of the ACF package. In general, the results show that, for given bonding geometric parameters and misalignment offset, the optimal volume fraction of conductive particles remains approximately constant as the pad array dimension is increased. However, for given bonding geometric parameters and pad array dimension, the optimal volume fraction of conductive particles increases with an increasing misalignment error. Overall, the results show that, for any given values of the bonding geometric parameters, pad array dimension, and misalignment offset, the failure probability of the ACF package can be minimized by setting the volume fraction of conductive particles equal to the value corresponding to the tip of the V-shaped curve.