An Updated Perspective of Single Event Gate Rupture and Single Event Burnout in Power MOSFETs
An Updated Perspective of Single Event Gate Rupture and Single Event Burnout in Power MOSFETs
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DOI:
10.1109/tns.2013.2252194
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发表时间:
2013-06-01
影响因子:
1.8
通讯作者:
Titus, Jeffrey L.
中科院分区:
文献类型:
--
作者:
Titus, Jeffrey L.
Studies over the past 25 years have shown that heavy ions can trigger catastrophic failure modes in power MOSFETs [e. g., single-event gate rupture (SEGR) and single-event burnout (SEB)]. In 1996, two papers were published in a special issue of the IEEE TRANSACTION ON NUCLEAR SCIENCE [Johnson, Palau, Dachs, Galloway and Schrimpf, "A Review of the Techniques Used for Modeling Single-Event Effects in Power MOSFETs," IEEE Trans. Nucl. Sci., vol. 43, no. 2, pp. 546-560, April. 1996], [Titus and Wheatley, "Experimental Studies of Single-Event Gate Rupture and Burnout in Vertical Power MOSFETs," IEEE Trans. Nucl. Sci., vol. 43, no. 2, pp. 533-545, Apr. 1996]. Those two papers continue to provide excellent information and references with regard to SEB and SEGR in vertical planar MOSFETs. This paper provides updated references/information and provides an updated perspective of SEB and SEGR in vertical planar MOSFETs as well as provides references/information to other device types that exhibit SEB and SEGR effects.