Doping sites observation of deep-level impurities in hyperdoped silicon via high-resolution transmission electron microscopy
Doping sites observation of deep-level impurities in hyperdoped silicon via high-resolution transmission electron microscopy
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通过高分辨率透射电子显微镜观察超掺杂硅中深层杂质的掺杂位点
DOI:
10.1016/j.jallcom.2019.07.252
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发表时间:
2019-10
影响因子:
6.2
通讯作者:
Wenbin Yang
中科院分区:
文献类型:
--
作者:
Cai Wen;Zhongqi Shi;Wenbin Yang
The direct observation of the doping sites of deep-level impurities in hyperdoped silicon is essential to determine the impurity diffusion, distribution, and precipitation via different hyperdoping processes or thermal annealing conditions. This is crucial to clarify the functioning of a mechanism, which can improve the impurity electroactivity. However, this observation, which is usually performed by using high-resolution transmission electron microscopy (HRTEM), is limited by some restrictions in the microscopic imaging conditions, such as the microscope resolution, the defocus of the objective lens, the specimen thickness, and the projected orientation of the specimen (i.e. the zone axis). Therefore, to eliminate these restrictions, conventional field-emission-gun HRTEM images in combination with image processing (deconvolution) were investigated in order to obtain structure images with atomic resolution. Both the substitutional and the interstitial doping sites of oxygen, chalcogen (sulfur and selenium), and transition metal (titanium and cobalt) impurities in silicon were determined by image contrast analysis. Finally, the favorable conditions for the direct observation of doping sites were defined.
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影响因子:
4
作者:
Kay-Michael Guenther;T. Gimpel;S. Kontermann;W. Schade
通讯作者:
Kay-Michael Guenther;T. Gimpel;S. Kontermann;W. Schade
影响因子:
4
作者:
A. Ourmazd;W. Tsang;J. Rentschler;D. W. Taylor
通讯作者:
A. Ourmazd;W. Tsang;J. Rentschler;D. W. Taylor
DOI:
10.1002/pssa.201026459
发表时间:
2010-12
期刊:
physica status solidi (a)
影响因子:
--
作者:
F. H. Li
通讯作者:
F. H. Li
影响因子:
2.8
作者:
C. Wen
通讯作者:
C. Wen
影响因子:
3.7
作者:
D. Alloyeau;B. Freitag;S. Dag;Lin Wang;C. Kisielowski
通讯作者:
D. Alloyeau;B. Freitag;S. Dag;Lin Wang;C. Kisielowski