Research on single-point diamond fly-grooving of brittle materials
Research on single-point diamond fly-grooving of brittle materials
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DOI：
10.1007/s00170-014-6245-1
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发表时间：
2014-08
期刊：
影响因子：
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通讯作者：
Y. Peng;T. Jiang;K. Ehmann
中科院分区：
文献类型：
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作者：
Y. Peng;T. Jiang;K. Ehmann
本文的目的是研究脆性材料切槽中单点金刚石飞切操作的加工机制。单点金刚石飞切广泛应用于自由曲面光学器件、半导体器件和微机电系统 (MEMS) 元件等的精密加工。对未变形切屑区域进行了分析，并讨论了其与临界脆/塑转变切削深度的关系。然后，提出了一种基于力学的模型来描述金刚石工具下的材料应力条件。将加工参数纳入模型中以了解飞切行为。结果表明，飞切技术非常适合通过在切屑形成区产生大的压缩压力来延性去除脆性材料。通过所用金刚石刀具的小进给率和大负前角可以进一步增强这种条件。通过在单晶硅上进行的飞槽实验证实和验证了理论结果。
The purpose of this paper is to investigate the machining mechanisms that accompany the single-point diamond fly-cutting operation in grooving of brittle materials. Single-point diamond fly-cutting is widely used in precision machining of free-form optics, semiconductor devices, and micro-electromechanical system (MEMS) components among many others. The undeformed chip zone was analyzed and its relation to the critical brittle/ductile transition depth of cut was discussed. Then, a mechanics-based model was proposed to describe the material stress condition under the diamond tool. The machining parameters were incorporated into the model to understand fly-cutting behavior. It was shown that the fly-cutting technique is highly suitable for the ductile removal of brittle materials by generating large compressive pressures in the chip formation zone. This condition can be further enhanced by a small feedrate and a large negative rake angle of the diamond tool used. The theoretical results were substantiated and verified by fly-grooving experiments performed on mono-crystalline silicon.