Print-and-peel fabrication of microelectrodes
Print-and-peel fabrication of microelectrodes
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DOI：
10.1021/la801752k
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发表时间：
2008-08-19
期刊：
影响因子：
3.9
通讯作者：
Vullev, Valentine I.
中科院分区：
文献类型：
--
作者：
Hong, Connie;Bao, Duoduo;Vullev, Valentine I.
我们描述了一种在光滑衬底上制造微电极阵列的简便易行的方法。一系列的打印和剥离程序允许使用办公设备和相对简单的湿化学进行电容微传感器的微制造。具有可逆粘附弹性体成分的微流控组件允许通过托伦斯反应沉积的金属银图案转移到基板表面。镀银图案产生了一排微米厚的铜电极。电容传感器是通过在微电极阵列上放置非光刻制造的流室来组装的。三角波形电流/电压（I/V）测量表明，打印剥离制造器件的电容与注入其流动室的样品的介电常数之间呈线性相关。
We describe a facile and expedient approach for the fabrication of arrays of microelectrodes on smooth substrates. A sequence of print-and-peel procedures allowed for the microfabrication of capacitance microsensors using office equipment and relatively simple wet chemistry. Microfluidic assemblies with reversibly adhered elastomer components allowed for the transfer of patterns of metallic silver, deposited via Tollens' reaction, onto the substrate surfaces. Electroplating of the silver patterns produced an array of micrometer-thick copper electrodes. Capacitance sensors were assembled by placing nonlithographically fabricated flow chambers over the microelectrode arrays. Triangular-waveform current-voltage (I/V) measurements showed a linear correlation between the capacitance of the print-and-peel fabricated devices and the dielectric constant of the samples injected into their flow chambers.