MEMS technologies for enabling high frequency communications circuits
MEMS technologies for enabling high frequency communications circuits
复制标题
用于实现高频通信电路的 MEMS 技术
DOI：
10.1109/telsks.1999.806236
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发表时间：
1999
期刊：
影响因子：
--
通讯作者：
J. Chiao
中科院分区：
文献类型：
--
作者：
V.M. Lubecke;J. Chiao
无线系统对增加数据容量、减小尺寸和功耗的要求已将射频集成电路 (RFIC) 技术推向极致。微机电系统 (MEMS) 技术已被用来展示高效微波组件，这些组件提供了一种经济地将硅 RFIC 技术扩展到微波频率以满足这些需求的方法。 MEMS 技术还被应用于创建具有成本效益的集成电路，这些集成电路可以在毫米波长及以上波长下高效运行，以进一步发挥在这些较高频率下增加带宽、减小尺寸和独特传播特性的优势。本文概述了最近展示的高频 MEMS 组件和技术，这些组件和技术可以增强现有的微波通信电路并实现经济的波通信。
Wireless systems requirements for increased data capacity and decreased size and power consumption have pushed radio frequency integrated circuit (RFIC) technology to extremes. Microelectromechanical systems (MEMS) techniques have been used to demonstrate high-efficiency microwave components that provide a means for economically extending silicon RFIC technology to microwave frequencies to meet these demands. MEMS techniques are also being applied to create cost-effective integrated circuits that can function efficiently at millimeter wavelengths and beyond, to further exploit the advantages of increased bandwidth, reduced size, and unique propagation characteristics available at these higher frequencies. An overview is presented here, of recently demonstrated high-frequency MEMS components and techniques that can enhance existing microwave communications circuits and enable economical wave communications.