Chebyshev Filter Design Using Vias as Quasi-Transmission Lines in Printed Circuit Boards

Chebyshev Filter Design Using Vias as Quasi-Transmission Lines in Printed Circuit Boards
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DOI:
10.1109/tmtt.2015.2396892
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发表时间:
2015-02
影响因子:
4.3
通讯作者:
A. Hardock;H. Bruns;C. Schuster
A. Hardock;H. Bruns;C. Schuster
中科院分区:
工程技术1区
文献类型:
--
作者:
A. Hardock;H. Bruns;C. Schuster

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本文提出了一种利用多层印刷电路板上的通孔设计微波滤波器的新概念。利用相邻有足够数量的地过孔的过孔可以近似为一定频率范围内的传输线的概念,推导出不同配置的过孔和地过孔对应的有效阻抗和相速度。通过控制这些传输在线参数,应用标准微波滤波方法设计了5-20 GHz频率范围内的低通和带通切比切夫滤波器。给出了测量和全波仿真结果作为验证。讨论了该方法的优点和局限性。
This paper presents a novel concept for microwave filter design using vias (plated through-holes) in multilayered printed circuit boards. By using the concept that vias accompanied by a sufficient number of ground vias in close proximity can be approximated as transmission lines in a certain frequency range, corresponding effective impedances and phase velocities for different configurations of vias and ground vias are deduced. By controlling these transmission-line parameters, standard microwave filter methodology is applied for the design of low-pass and bandpass Chebychev filters in the frequency range of 5-20 GHz. Measurements and full-wave simulation results are presented as validation. Advantages and limitations of the proposed method are discussed.