Chebyshev Filter Design Using Vias as Quasi-Transmission Lines in Printed Circuit Boards
Chebyshev Filter Design Using Vias as Quasi-Transmission Lines in Printed Circuit Boards
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DOI:
10.1109/tmtt.2015.2396892
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发表时间:
2015-02
影响因子:
4.3
通讯作者:
A. Hardock;H. Bruns;C. Schuster
中科院分区:
文献类型:
--
作者:
A. Hardock;H. Bruns;C. Schuster
This paper presents a novel concept for microwave filter design using vias (plated through-holes) in multilayered printed circuit boards. By using the concept that vias accompanied by a sufficient number of ground vias in close proximity can be approximated as transmission lines in a certain frequency range, corresponding effective impedances and phase velocities for different configurations of vias and ground vias are deduced. By controlling these transmission-line parameters, standard microwave filter methodology is applied for the design of low-pass and bandpass Chebychev filters in the frequency range of 5-20 GHz. Measurements and full-wave simulation results are presented as validation. Advantages and limitations of the proposed method are discussed.