Properties and applications of Ti-Ni-Cu shape-memory-alloy thin films
Properties and applications of Ti-Ni-Cu shape-memory-alloy thin films
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DOI：
10.1016/j.jallcom.2011.12.155
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发表时间：
2013-11-15
影响因子：
6.2
通讯作者：
Gao, Z. Y.
中科院分区：
文献类型：
--
作者：
Ishida, A.;Sato, M.;Gao, Z. Y.
从实际应用的角度综述了含0-37.3at%Cu和44.6-55.4at%Ti的Ti-Ni-Cu薄膜的形状记忆行为。在873K下热处理1h的薄膜具有如下吸引人的特性：(1)单级相变，(2)较高的相变温度，(3)较小的温度滞后，(4)稳定的形状记忆效应，(5)足够的可恢复应变，(6)可靠的力学性能，(7)相变温度的成分不敏感。利用合金靶材制备了Ti-Ni-Cu薄膜，验证了溅射法大规模生产的可行性。提出了一些应用，如聚碳酸酯/钛镍铜薄膜驱动器，以促进钛镍铜薄膜的实际应用。(C)2012爱思唯尔B.V.保留所有权利。
The shape memory behavior of Ti-Ni-Cu thin films with 0-37.3 at% Cu and 44.6-55.4 at% Ti is overviewed from the viewpoint of practical application. Films annealed at 873 K for 1 h exhibit attractive properties such as (1) single-stage transformation, (2) relatively high transformation temperatures, (3) small temperature hysteresis, (4) stable shape memory effect, (5) sufficient recoverable strain, (6) reliable mechanical properties, and (7) composition insensitivity of transformation temperatures. Fabrication of Ti-Ni-Cu thin films from an alloy target verified the feasibility of mass production by sputtering. Some applications such as a polyirnide/Ti-Ni-Cu film actuator are proposed to facilitate the practical use of Ti-Ni-Cu films. (C) 2012 Elsevier B.V. All rights reserved.