Amorphous silicon nitride deposited by hot-wire chemical vapor deposition
Amorphous silicon nitride deposited by hot-wire chemical vapor deposition
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热丝化学气相沉积非晶氮化硅
DOI:
10.1063/1.1775046
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发表时间:
2004
影响因子:
3.2
通讯作者:
Shulin Wang
中科院分区:
文献类型:
--
作者:
Fengzhen Liu;S. Ward;L. Gedvilas;B. Keyes;B. To;Qi Wang;E. Sanchez;Shulin Wang
High-quality amorphous silicon nitrides were deposited by hot-wire chemical vapor deposition using SiH4, NH3, and H2 gases. These films show a high deposition rate of 5A∕s, a low processing temperature of 300°C, an excellent conformal coverage, a low etching rate of 7A∕min, an index of refraction of 2.1, an optical band gap of 4.0eV, and a high breakdown field of 3MV∕cm. The effects of hydrogen dilution, substrate temperature, chamber pressure, and filament temperature on silicon nitride film property were studied to optimize the process. We found that adding H2 to the processing significantly enhances the silicon nitride films’ properties. The N content in the film increased significantly based on the infrared measurement. Hydrogen dilution is believed to play a key role for the conformal silicon nitride film. Hydrogen dilution also improves the process in that the gas ratio of NH3∕SiH4 has been greatly reduced with the assistance of the H2 gas. With substrate temperatures varying from 23°to400°C, this s...