Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems
Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems
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DOI：
10.1007/s11664-001-0212-y
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发表时间：
2001
影响因子：
2.1
通讯作者：
K. Zeng;J. Kivilahti
中科院分区：
文献类型：
--
作者：
K. Zeng;J. Kivilahti
虽然在互连应用中从未达到完全相平衡，但在界面处局部平衡的假设在大多数由不同材料组成的系统中通常是有效的。因此，在三元（或多组分）相平衡的连接线，连同相关的稳定性图和质量平衡的要求，可用于预测形成的相序列（即扩散路径），例如，在焊料/导体接头。一般来说，二元相图不能单独提供足够的信息，在焊料/导体系统的相形成，因为它们不承担任何信息的相对稳定性不同的二元相在多组分系统。作为例子，金属间化合物的形成在几个焊料/导体系统与Au-或Cu-金属化的帮助下，三元相图以及实验研究。用热力学方法计算了相图。实验结果证实，金属间化合物的形成对温度和焊料成分的依赖性清楚地表示由相图补充的稳定性图。
Although the complete phase equilibrium is never reached in interconnection applications, the assumption of local equilibrium at the interfaces is generally valid in most systems composed of dissimilar materials. Therefore, the tie lines in ternary (or multicomponent) phase diagrams—together with the relevant stability diagrams and the mass balance requirements—can be used for predicting the phase sequences (i.e. diffusion paths) formed, for example, in solder/conductor joints. Generally, binary phase diagrams alone cannot provide sufficient information on the phase formation in solder/conductor systems because they do not bear any information on the relative stabilities between different binary phases in multicomponent systems. As examples, the formation of intermetallic compounds in several solder/conductor systems with Au- or Cu-metallization was studied with the help of ternary phase diagrams as well as experimentally. The phase diagrams were calculated using thermodynamic methods. The experimental results confirmed that the dependence of formation of intermetallic compounds on temperature and solder composition is clearly represented by the phase diagrams supplemented with the stability diagrams.