Pulsed Thermoelectric Cooling for Improved Suppression of a Germanium Hotspot
Pulsed Thermoelectric Cooling for Improved Suppression of a Germanium Hotspot
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DOI：
10.1109/tcpmt.2013.2286740
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发表时间：
2014-04
期刊：
影响因子：
--
通讯作者：
M. Manno;Peng Wang;A. Bar-Cohen
中科院分区：
文献类型：
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作者：
M. Manno;Peng Wang;A. Bar-Cohen
随着热点成为电子器件设计中越来越重要的因素，开发新颖的近结冷却方法已变得至关重要。稳态热电冷却先前已被认为是用于去除各种基板上的局部热点。本文描述了以基片为热电路支路的锗热电自冷器的瞬态特性。在商业有限元分析软件ANSYS中创建了3-D热电数值模型，并用于探索各种初始条件、电流脉冲持续时间、电流脉冲幅度、脉冲形状和模具厚度的影响。结果表明，脉冲瞬态热电冷却有可能提高热点温度降低约30%，相对于什么是在稳定状态下实现。此外，发现较大的电流通常导致更快速的热电冷却，但也导致大的过冲温度，并且所施加的电流分布对冷却器的瞬态行为具有强烈的影响。
As hotspots become an increasingly important factor in the design of electronic devices, it has become essential to develop novel near-junction cooling methods. Steady-state thermoelectric cooling has previously been considered for the removal of localized hotspots on various substrates. In this paper, the transient behavior of a germanium thermoelectric self-cooler, in which the chip substrate is used as a leg of the thermoelectric circuit, is described. A 3-D thermoelectric numerical model was created in the commercial FEA package ANSYS and is used to explore the effects of various initial conditions, current pulse durations, current pulse magnitudes, pulse shapes, and die thicknesses. The results suggest that pulsed transient thermoelectric cooling has the potential to improve hotspot temperature reduction by approximately 30% relative to what is achievable in steady state. In addition, it was found that larger currents generally cause more rapid thermoelectric cooling, but also result in large overshoot temperatures and that the applied current profile has a strong effect on the transient behavior of the cooler.