Inhibitory action of 8-HYDROXYQUINOLINE on the copper corrosion process
Inhibitory action of 8-HYDROXYQUINOLINE on the copper corrosion process
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DOI：
10.1016/s0010-938x(98)00090-0
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发表时间：
1998-11
影响因子：
8.3
通讯作者：
G. P. Cicileo;B. Rosales;F. Varela;J. R. Vilche
中科院分区：
文献类型：
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作者：
G. P. Cicileo;B. Rosales;F. Varela;J. R. Vilche
研究了8-羟基喹啉（HQ）在中性NaCl水溶液中对铜的缓蚀作用。失重测量和电化学方法（阻抗谱和动电位极化）被施加到分析的金属腐蚀行为的存在和不存在的抑制剂，这是一种铜离子络合剂。使用XPS、FTIR和SEM-EDX的表面分析使我们能够澄清机理方面并评估相对抑制效率。有人指出，保护膜是通过聚合的Cu（II）-羟基喹啉配合物的表面上形成的，膜中起着重要的作用，在抑制铜腐蚀。对Cu溶解过程的抑制机制也与HQ分子在表面上的吸附有关，避免了溶液中侵蚀性离子的吸附，如Cl−或OH−。
The effect of 8-hydroxyquinoline (HQ) on the corrosion inhibition of copper has been investigated in neutral aqueous NaCl solutions. Weight-loss measurements and electrochemical methods (impedance spectroscopy and potentiodynamic polarisation) were applied to analyse the metal corrosion behaviour in the absence and presence of the inhibitor, which is a copper ion complexing agent. Surface analysis using XPS, FTIR, and SEM–EDX allowed us to clarify the mechanistic aspects and evaluate the relative inhibitory efficiency. It was stated that a protective film is formed on the surface by polymerisation of Cu (II)–hydroxyquinoline complexes, films that plays an essential role in the inhibition of Cu corrosion. The inhibitory mechanism on the Cu dissolution process was also related to the adsorption of the HQ molecules on the surface, avoiding the adsorption of aggressive ions in solution, such as Cl−or OH−.