Viscoelastic properties and internal stress of thermosetting resin in curing process

Viscoelastic properties and internal stress of thermosetting resin in curing process
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热固性树脂固化过程中的粘弹特性及内应力

DOI:
10.2472/jsms.43.18
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发表时间:
1994
期刊:
Journal of The Society of Materials Science, Japan
影响因子:
--
通讯作者:
K. Ikegami
K. Ikegami
中科院分区:
--
文献类型:
--
作者:
M. Ohori;C. Sato;K. Ikegami

文献摘要

被引文献

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采用粘弹性模型分析了热固性树脂固化过程中产生的内应力。通过旋转流变仪对固化过程中粘弹性的变化进行了实验测量。采用三元弹簧阻尼模型建立了固化过程中的粘弹性本构关系。对两层树脂和金属在固化过程中的变形进行了实验研究。结果与 F.E.M. 进行了比较。基于树脂的粘弹性关系和收缩模型进行分析。粘弹性分析给出的结果比弹性分析更真实。
The internal stress of thermosetting resin generated during curing process was analyzed by using a viscoelastic model. The changes in viscoelastic properties in the curing process were measured experimentally by a rotating rehometer. The viscoelastic constitutive relations in the curing process were formulated by the three elements spring dashpot model. The deformation of two layered resin and metal in the curing process was investigated experimentally. The results were compared with F.E.M. analysis on the basis of the viscoelastic relations and shrinkage model of the resin. The viscoelastic analysis gave more realistic results than the elastic analysis.