Low Temperature Joining and High Temperature Application of Segmented Half Heusler/Skutterudite Thermoelectric Joints
Low Temperature Joining and High Temperature Application of Segmented Half Heusler/Skutterudite Thermoelectric Joints
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DOI：
10.3390/ma13010155
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发表时间：
2019-12
期刊：
影响因子：
3.4
通讯作者：
Weian Wang;Xiaoya Li;M. Gu;Yunfei Xing;Y. Bao
中科院分区：
文献类型：
--
作者：
Weian Wang;Xiaoya Li;M. Gu;Yunfei Xing;Y. Bao
开发了一种低温连接工艺来制备节段式半Heusler/Skutterudite热电接头，并对其高温使用性能进行了研究。研究了时效前后接头的微观组织和电阻变化。时效前后接头结合良好，界面无裂纹，这与高熔点金属间化合物的形成有关。电阻平稳地穿过粘结层，接触电阻低。这些结果表明，该工艺是有效的，有望用于制备分段式热电器件。
A low temperature joining process has been developed to fabricate segmented half Heusler/skutterudite thermoelectric joints, and high temperature service behavior of the joints has been studied. The microstructure and electrical resistance across the joint before and after aging were investigated. The joint is well bonded and no cracks appear at the interfaces of the joint before and after aging, which can attribute to the formation of high melting point intermetallic compounds. The electrical resistance crosses the bonding layer smoothly and the contact resistance is low. These results show the process is effective, and promising for preparation of segmented thermoelectric devices.