MICROMACHINING USING A FOCUSED ION-BEAM
MICROMACHINING USING A FOCUSED ION-BEAM
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DOI：
10.1016/0042-207x(93)90182-a
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发表时间：
1993-03-01
期刊：
影响因子：
4
通讯作者：
YOUNG, RJ
中科院分区：
文献类型：
--
作者：
YOUNG, RJ
本文描述了利用聚焦离子束(FIB)对微米和亚微米级结构进行微加工。考虑了微细加工系统的一般要求和FIB铣削的特点。还讨论了FIB球磨的一系列应用。其中包括失效分析和器件修改，它们现在半导体研究中得到了广泛的应用。在其他领域(如光学和微机械)的应用正在增加，FIB铣削是一种非常灵活和精确的制造原型或特殊结构的方法。
This paper describes the micro-machining of micron and sub-micron scale structures by focused ion beams (FIB). The general requirements for micro -machining systems and the characteristics of FIB milling are considered. A range of applications of FIB milling are also discussed. These include failure analysis and device modification, which are now finding wide use in semiconductor research. Applications in other areas (such as optics and micro-mechanics) are increasing in number, FIB milling being a very flexible and precise method for producing prototype or specialized structures.