Fabrication of a paraffin actuator using hot embossing of polycarbonate

Fabrication of a paraffin actuator using hot embossing of polycarbonate
复制标题

DOI:
10.1016/s0924-4247(02)00403-x
复制
发表时间:
2003-02-15
影响因子:
4.6
通讯作者:
Thornell, G
Thornell, G
中科院分区:
工程技术3区
文献类型:
--
作者:
Klintberg, L;Svedberg, M;Thornell, G

文献摘要

被引文献

相似文献

本文概述了在聚碳酸酯中集成石蜡驱动结构的制造工艺。一个石蜡驱动的膜,直径为2.5毫米,其中10-15%的体积膨胀与石蜡的固-液相变被利用,已被制造和评估。在硅中制造的微结构通过电镀镍模具通过热压印在聚碳酸酯中复制,并且所得到的结构通过热粘合密封。通过加压试验测量结合强度,并用电子能谱化学分析(ESCA)表征聚碳酸酯表面。结果发现,当在键合之前使用氧等离子体处理时,键合强度增加。ESCA测量表明等离子体处理的表面上的氧含量相应增加。该程序还改善了润湿性能。石蜡与聚碳酸酯之间的接触角从压花后的10度下降到等离子体处理后的约50度。所制造的致动器具有1 mm的总厚度,并且当将致动器加热到高于石蜡的熔点时,膜偏转约140 μ m。石蜡致动器可以集成在塑料结构中,使得它们在诸如一次性微流体系统的应用中成为有希望的候选者,在这些应用中需要廉价且坚固的阀和泵。(C)2002 Elsevier Science B. V.保留所有权利。
In this paper a fabrication process for integrating paraffin-actuated structures in polycarbonate is outlined. A paraffin-actuated membrane with a diameter of 2.5 mm, where the volume expansion of 10-15% associated with the solid-to-liquid phase transition of paraffin is utilized, has been fabricated and evaluated. Microstructures fabricated in silicon have via an electroplated nickel mould been replicated in polycarbonate by hot embossing and the resulting structures have been sealed by thermal bonding. The bonding strength was measured by a pressurizing test, and the polycarbonate surfaces were characterized with electron spectroscopy for chemical analysis (ESCA). It was found that the bond strength increased when an oxygen plasma treatment was used prior to bonding. ESCA measurements showed a corresponding increase in oxygen content on the plasma treated surfaces. This procedure also improved the wetting properties. The contact angle between paraffin and polycarbonate decreased from 10degrees after embossing to about 5degrees after plasma treatment. The fabricated actuator had a total thickness of 1 mm and the membrane deflected about 140 mum when heating the actuator above the melting point of paraffin. Paraffin wax actuators are possible to integrate in plastic structures making them promising candidates in applications such as disposable microfluidic systems where inexpensive and robust valves and pumps are needed. (C) 2002 Elsevier Science B.V. All rights reserved.