Power and speed analysis of miniaturized SOI y-branch Mach-Zehnder thermo-optic switches
Power and speed analysis of miniaturized SOI y-branch Mach-Zehnder thermo-optic switches
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DOI：
10.1117/12.842737
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发表时间：
2010-02
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影响因子：
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通讯作者：
K. P. Yap;T. Smy;J. Schmid;P. Waldron;A. Densmore;B. Syrett;S. Janz
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文献类型：
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作者：
K. P. Yap;T. Smy;J. Schmid;P. Waldron;A. Densmore;B. Syrett;S. Janz
我们计算了几个1×1 y分支MZI SOI热光开关的π功率和上升时间与器件尺寸的函数关系。这些开关由波导芯厚度从10 μ m到0.22 μm组成。在缩放核心厚度时，最佳功率和速度性能出现在0.7 μm处。进一步的小型化导致功率增加和速度降低，这主要是由于从纤芯到包层的模式扩展。我们表明，改变MZI臂间距是一种有效的方法，以提高小型化的热光开关的性能。
We calculate the π-power and rise time for several 1×1 y-branch MZI SOI thermo-optic switches as a function of device size. These switches consist of waveguide core thickness ranging from 10 to 0.22 μm. Upon scaling the core thickness, the best power and speed performance occurs at 0.7 μm. Further miniaturization results in an increased power and reduced speed, mainly due to the mode expansion from the core into the cladding. We show that varying the MZI arm separation is an effective approach to improve the performance of miniaturized thermo-optic switches.