Effect of Preparation Temperature on the Aging Properties of Waste Polyethylene Modified Asphalt
Effect of Preparation Temperature on the Aging Properties of Waste Polyethylene Modified Asphalt
复制标题
制备温度对废旧聚乙烯改性沥青老化性能的影响
DOI：
10.1016/j.jmst.2014.04.019
复制
发表时间：
2015-03-01
影响因子：
10.9
通讯作者：
Liu, Xiaolong
中科院分区：
文献类型：
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作者：
Fang, Changqing;Zhang, Mengya;Liu, Xiaolong
在这项研究中，废聚乙烯（WPE）被用作基础沥青的改性剂。在我们之前的研究中，我们研究了多种用于沥青的聚合物改性剂。相比之下，很少有研究关注制备过程，例如制备时间、制备温度和剪切速率。本文研究了制备温度对WPE改性沥青老化性能的影响。通过红外光谱（IR）、热重分析（TG）和差示扫描量热法（DSC）对实验材料进行了表征。物理性能通过进行沥青针入度、软化点和延展性测试来确定。结果表明，提高制备温度会导致 WPE 改性沥青的软化点升高，但针入度和延度降低。此外，实验材料的老化加剧了这种变化。 WPE的改性过程是一个物理过程。在沥青改性过程中，WPE随着制备温度的升高而老化。结果表明，190℃是最合适的制备温度，后老化沥青的高温稳定性得到改善。版权所有(C)2015，材料科学与技术学报编辑部。由爱思唯尔有限公司出版。版权所有。
In this study, waste polyethylene (WPE) was used as a modifier for base asphalt. In our previous studies, we have examined a variety of polymer modifiers for asphalt. By contrast, little research has focused on the preparation process, such as preparation time, preparation temperature and shear rate. The effect of preparation temperature on aging properties of WPE-modified asphalt was investigated in this work. The experimental materials were characterized by infrared spectroscopy (IR), thermo-gravimetric analysis (TG), and differential scanning calorimetry (DSC). The physical properties were determined by conducting asphalt penetration, softening point and ductility tests. The results show that increasing the preparation temperature results in an increased softening point of WPE-modified asphalt while decreased penetration and ductility. In addition, this variation was accentuated by aging the experimental materials. The modification process of WPE is a physical process. During the asphalt modification process, the WPE aged as the preparation temperature increased. The results revealed that 190 degrees C is the most suitable preparation temperature, and the post aged asphalt demonstrated improved high temperature stability. Copyright (C) 2015, The editorial office of Journal of Materials Science & Technology. Published by Elsevier Limited. All rights reserved.