Comparative study of the dentin bond strength of a new universal adhesive

Comparative study of the dentin bond strength of a new universal adhesive
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DOI:
10.4012/dmj.2015-422
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发表时间:
2016-08-01
影响因子:
2.5
通讯作者:
Kim, Duck-Su
Kim, Duck-Su
中科院分区:
工程技术3区
文献类型:
--
作者:
Jang, Ji-Hyun;Lee, Myoung Geun;Kim, Duck-Su

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本研究比较了新型通用粘结剂与当代多步牙本质粘接剂的牙本质粘接强度。根据使用的粘接剂及其应用模式,制备了6个实验组:Optiond FL(OB)、Adper Single Bond Plus(SB)、One-Step Plus(OS)、Clearfe SE Bond(CS)、All-Bond Universal Use Use-a-Rate-Rresse(ABE)和All-Bond Universal Use Self-Rate Made(ABS)。对各组的微拉伸粘结强度(MU TBS)和破坏模式进行评估。用透射电子显微镜对粘结界面进行了分析。结果表明,6个试验组的MU-TBS分别为:OB=ABE=SE=ABS>SB>OS组。ABE组和ABS组的电子显微镜照片显示形成了均匀的粘附层。综上所述,一种新型的万能粘结剂可以可靠地粘接牙本质,而不受使用方式的限制。
This study compared the dentin bond strength of a new universal adhesive with that of contemporary multi-step dentin adhesives. Six experimental groups were prepared according to the adhesives used and their application modes: Optibond FL (OB), Adper Single Bond Plus (SB), One-Step Plus (OS), Clearfil SE Bond (CS), All-Bond Universal using etch-and-rinse mode (ABE), and All Bond Universal using self-etch mode (ABS). Micro-tensile bond strength (mu TBS) and failure mode were evaluated for each group. The bonded interface was analyzed using transmission electron microscopy (TEM). As a result, mu TBS of 6 experimental groups was followed as: OB=ABE=SE=ABS>SB>OS group. TEM micrographs of ABE and ABS groups revealed a homogenous adhesive layer formation. In conclusion, a new universal adhesive can make reliable bond to dentin, regardless of the application mode.