Loss Analysis and Engineering of Spoof Surface Plasmons Based on Circuit Topology
Loss Analysis and Engineering of Spoof Surface Plasmons Based on Circuit Topology
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DOI：
10.1109/lawp.2017.2768551
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发表时间：
2017-11
影响因子：
4.2
通讯作者：
Xuanru Zhang;Hankun Zhang;W. Tang;Jun Feng Liu;Z. Fang;J. Wu;T. Cui
中科院分区：
文献类型：
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作者：
Xuanru Zhang;Hankun Zhang;W. Tang;Jun Feng Liu;Z. Fang;J. Wu;T. Cui
通过数值模拟和电路拓扑建模，并结合实验验证，系统研究了表面贴装电阻欺骗表面等离子体传输线（SSP-TL）的损耗机理。由电阻引入的畸变色散和损耗曲线同时由数值结果预测，并由电路拓扑模型解释。根据电路拓扑模型设计了由周期性负载电阻和T型网络构成的衰减器，并通过仿真和实验验证了其有效性，从而在深亚波长范围内实现了显著且可控的损耗。所提出的结构和方法使得能够对SSP-TL有深刻的理解，并在其他有损SSP器件的研究和设计中保持希望。
We propose to systematically investigate the loss mechanism in spoof surface plasmon transmission lines (SSP-TLs) associated with surface-mounted resistors, by numerical simulation and circuit topology modeling, with the experimental validations. Distorted dispersion and loss curves introduced by the resistors are simultaneously predicted by the numerical results and interpreted by the circuit topology model. Attenuators constructed by periodically loaded resistors and T-type networks are designed according to the circuit topology model, and validated by both simulation and experiment results; hence, significant and controllable losses are achieved in a deep-subwavelength scale. The proposed structures and methods enable insightful understanding of the SSP-TLs and hold promise in other lossy SSP device study and design.