Effect of mask wall angle on shape evolution during through-mask electrochemical micromachining
Effect of mask wall angle on shape evolution during through-mask electrochemical micromachining
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DOI：
10.1149/1.1836477
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发表时间：
1996-02-01
影响因子：
3.9
通讯作者：
Datta, M
中科院分区：
文献类型：
--
作者：
Shenoy, RV;Datta, M
建立了一种通过掩模电化学微加工（EMM）过程中形状演变的数学模型。用边界元法求解了具有描述欧姆控制下金属溶解过程的边界条件的拉普拉斯电势方程。确定了掩膜壁角对腔体形状、腔内电流分布和腐蚀因子的影响。当掩模壁角小于90度时，由于掩模的阴影效应，腐蚀因子增大，而当掩模壁角大于90度时，腐蚀因子减小。随着金属膜厚度的增加，掩膜壁角的影响逐渐减小。
A mathematical model to predict shape evolution during through-mask electrochemical micromachining (EMM) has been developed. Boundary element method has been used to solve the Laplace equation for electric potential with appropriate boundary conditions that describe the metal dissolution process under ohmic control. The influence of mask wall angle on shape of the evolving cavity, current distribution within the cavity and etch factor have been determined. For mask wall angles less than 90 degrees, the etch factor increased due to the shadowing effect of the mask, whereas the etch factor decreased for mask wall angles greater than 90 degrees. The influence of mask wall angle has been found to diminish with increasing metal film thickness.