Residual stress assessment of interconnects by slot milling with FIB and geometric phase analysis
Residual stress assessment of interconnects by slot milling with FIB and geometric phase analysis
复制标题
通过 FIB 铣槽和几何相位分析来评估互连的残余应力
DOI：
10.1016/j.optlaseng.2009.12.006
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发表时间：
2010-11-01
影响因子：
4.6
通讯作者：
Gu, Changzhi
中科院分区：
文献类型：
--
作者：
Wang, Qinghua;Xie, Huimin;Gu, Changzhi
基于聚焦离子束设备的铣削-成像组合能力，提出了一种通过槽铣削和几何相位分析测量互连体残余应力的新方法。该方法通过几何相位分析测量应力释放引起的垂直于槽的位移场，然后通过有限元法求解互连线上的残余应力，在聚焦离子束设备上进行光栅加工、槽铣削和显微照片采集，发现槽边缘的位移和铜互连线上的残余应力在26 ~ 45 nm和265 ~ 467 MPa之间。分别。这项工作提供了一种有效的方法来确定薄膜线的残余应力(C) 2009 Elsevier Ltd。版权所有
Based on the combined milling-imaging capabilities of focused ion-beam equipment, a novel approach of measuring residual stress of interconnects by slot milling and geometric phase analysis is presented. This method is performed through measuring the displacement field perpendicular to the slot due to the stress release by geometric phase analysis, and then solving the residual stress along the Interconnect line by finite element method Grating fabrication, slot milling and micrographs capturing are implemented in focused ion-beam equipment The displacement at the edge of the slot and the residual stress of a copper interconnect line were found to be in the range 26-45 nm and 265-467 MPa, respectively. This work provides an effective way to determine the residual stress of film lines (C) 2009 Elsevier Ltd. All rights reserved