Material potential and scalability challenges of germanium CMOS

Material potential and scalability challenges of germanium CMOS
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DOI:
10.1109/iedm.2011.6131631
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发表时间:
2011-12
期刊:
2011 International Electron Devices Meeting
影响因子:
--
通讯作者:
A. Toriumi;C. H. Lee;S. K. Wang;T. Tabata;M. Yoshida;D. Zhao;T. Nishimura;K. Kita;K. Nagashio
A. Toriumi;C. H. Lee;S. K. Wang;T. Tabata;M. Yoshida;D. Zhao;T. Nishimura;K. Kita;K. Nagashio
中科院分区:
其他
文献类型:
--
作者:
A. Toriumi;C. H. Lee;S. K. Wang;T. Tabata;M. Yoshida;D. Zhao;T. Nishimura;K. Kita;K. Nagashio

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本文从GeO 2/Ge栅叠层的材料科学和反型层迁移率的器件物理两个方面综述了Ge MOSFET的技术现状,并从Ge/高k栅叠层和ET-GeOI MOSFET的角度讨论了进一步小型化的前景和基本挑战。
This paper overviews the present status of Ge MOSFET technology, particularly focusing on n-FETs in terms of materials science of GeO2/Ge gate stacks and device physics of inversion layer mobility, and then discusses future prospects and fundamental challenges for further miniaturization from the viewpoint of Ge/high-k gate stacks and ET-GeOI MOSFETs.