Effect of rapid solidification on mechanical properties of a lead free Sn–3.5Ag solder
Effect of rapid solidification on mechanical properties of a lead free Sn–3.5Ag solder
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DOI：
10.1016/j.jallcom.2010.05.179
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发表时间：
2010-08
影响因子：
6.2
通讯作者：
R. Shalaby
中科院分区：
文献类型：
--
作者：
R. Shalaby
对Sn-3.5Ag、Sn-3.5Ag-2 In、Sn-3.5Ag-2Bi和Sn-3.5Ag-2 Zn无铅钎料的快淬工艺进行了研究和分析。结果表明，在快淬过程中，合金中形成了镶嵌在Sn基体中的Ag-Ag_3Sn、In_（0.2）Sn_（0.8）和AgZn金属间化合物，而不是在平衡条件下形成的。添加少量（2 wt.%）In、Bi或Zn细化晶粒尺寸，增加Hv，延迟断裂强度并改善抗蠕变性。三元合金具有比二元合金Sn-3.5Ag更上级的机械性能，因为它具有均匀的细小分散的沉淀物和小的有效晶粒尺寸。结果表明，在Sn-3.5Ag-2 In、Sn-3.5Ag-2Bi和Sn-3.5Ag-2 Zn三种成分的无铅钎料中，由于快速凝固过程中共晶点的移动，形成了共晶成分。铟、铋和锌的加入降低了Sn-Ag二元系的熔化温度。
The melt-spinning processes of Sn–3.5Ag, Sn–3.5Ag–2In, Sn–3.5Ag–2Bi and Sn–3.5Ag–2Zn lead free solders were investigated and analyzed. The results showed that formation of intermetallic compounds of ɛ-Ag3Sn, In0.2Sn0.8and AgZn embedded in Sn matrix phase, were produced during melt-spinning technique not found under equilibrium conditions. Addition of small amount (2wt.%) In, Bi, or Zn refines the grain size, increases Hv, delay the fracture strength and improves creep resistance. The ternary alloys exhibits mechanical properties superior to that of the binary alloy Sn–3.5Ag because it has a uniform fine dispersion of precipitates and small effective grain size. It is found that in the lead free solder has composition of Sn–3.5Ag–2In, Sn–3.5Ag–2Bi and Sn–3.5Ag–2Zn melt-spun alloys, have eutectic composition which could be attributed to the shift of eutectic point under rapid solidification. The addition of indium, bismuth and zinc to the Sn–Ag binary system lowers the melting temperature.