Correlation between resin viscosity and imprinting pressure mode
Correlation between resin viscosity and imprinting pressure mode
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树脂粘度与压印压力模式的相关性
DOI：
10.1007/s13391-013-6013-7
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发表时间：
2013
影响因子：
2.4
通讯作者：
Heon Lee
中科院分区：
文献类型：
--
作者：
S. Jang;Jae;Heon Lee
通过改变树脂粘度和压印压力模式，研究了压印过程中周期的变化。如果需要压印工艺来达到建议的残余树脂厚度或窗口打开水平，则应根据压印压力的大小和速率指定适当的加工周期，因为残留层厚度(RLT)受这些因素的影响很大。此外，树脂粘度对RLT变化的影响与压印压力模式的影响一样显著。我们使用具有重复椭圆突起的模具进行了数值模拟，图案密度为12.03%，以确定所考虑的工艺因素对压印工艺周期的影响。
The changes in the period of the imprinting process were studied by changing resin viscosities and imprinting pressure mode. If an imprinting process is required to achieve a proposed level of residual resin thickness or window open, an appropriate process period should be assigned with respect to the magnitude and rate of the imprinting pressure because the residual layer thickness (RLT) is significantly influenced by these factors. Furthermore, the impact of resin viscosity on RLT variation is as significant as that of the imprinting pressure mode. We performed a numerical simulation using a mold having repetitive elliptical protrusions with a pattern density of 12.03% to determine the influence of the considered process factors on the imprinting process period.