Fast and slow stress evolution mechanisms during interruptions of Volmer-Weber growth
Fast and slow stress evolution mechanisms during interruptions of Volmer-Weber growth
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Volmer-Weber 生长中断期间的快速和慢速应力演化机制
DOI：
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发表时间：
2014
期刊：
影响因子：
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通讯作者：
C. Thompson
中科院分区：
文献类型：
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作者：
Hang Z. Yu;J. Leib;S. Boles;C. Thompson
薄膜在Volmer-Weber生长过程中的机械应力演化是复杂的，通常包括薄膜沉积中断期间的可逆应力演化。生长中断期间应力演化的潜在机制一直存在广泛的争论，但仍不清楚。在这项工作中，在不同的时间尺度、薄膜厚度和衬底温度下，对生长中断期间的应力演化进行了原位测量。发现至少有两种机制导致了所观察到的应力演化，一种是快速（时间常数为~ 102 s），另一种是缓慢（时间常数为~ 104 s）。快速过程是可逆的，对薄膜厚度的依赖性弱，而缓慢过程是不可逆的，对薄膜厚度的依赖性强。结果表明，生长中断期间的晶粒生长可以解释与缓慢过程相关的应力变化的重要部分。快速可逆过程可能与…
The evolution of mechanical stress during Volmer-Weber growth of thin films is complex, often including a reversible stress evolution during interruptions of film deposition. The underlying mechanism for stress evolution during growth interruptions has been extensively debated, but remains unclear. In this work, in situ measurements of stress evolution during growth interruptions of various time scales, film thicknesses, and substrate temperatures were made during deposition of gold and nickel films. It was found that at least two mechanisms lead to the observed stress evolution, one fast (time constant ∼102 s) and one slow (time constant ∼104 s). The fast process is reversible and weakly dependent on the film thickness, while the slow process is irreversible and strongly dependent on the film thickness. It is shown that grain growth during growth interruptions can account for a significant portion of the stress change associated with the slow process. The fast reversible process is likely to be associate...