Transient liquid phase diffusion bonding under a temperature gradient: modelling of the interface morphology
Transient liquid phase diffusion bonding under a temperature gradient: modelling of the interface morphology
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DOI：
10.1016/s1359-6454(00)00307-4
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发表时间：
2001-01
期刊：
影响因子：
9.4
通讯作者：
H. Assadi;A. Shirzadi;E. Wallach
中科院分区：
文献类型：
--
作者：
H. Assadi;A. Shirzadi;E. Wallach
瞬时液相（TLP）扩散焊接时施加温度梯度，可获得剪切强度与母材（例如铝基合金和复合材料）一样高的可靠接头。这种新方法的关键特征依赖于非平面界面的形成，这是由于在结合温度下液体层（通常具有共晶组合物）固化期间在固/液界面处的形态不稳定性。本文提出了一个模型，它是能够预测界面形态和键合条件，导致在使用这种新的键合方法时，形成非平面键合线。模型的结果提供了一个洞察凝固过程的本质。实验验证了所提出的模型时，连接纯铝和铝合金（6082）使用铜中间层。
Imposing a temperature gradient when transient liquid phase (TLP) diffusion bonding results in reliable joints with shear strengths as high as those of the parent material (e.g. aluminium-based alloys and composites). The key feature of this new method relies on the formation of non-planar interfaces as a consequence of morphological instability at the solid/liquid interface during solidification of the liquid layer (normally with a eutectic composition) at the bonding temperature. A model is proposed in this paper which is capable of predicting interface morphology and the bonding conditions which result in the formation of non-planar bond lines when using this new bonding method. The results of model provide an insight to the nature of the solidification process. The proposed model was verified experimentally when bonding pure aluminium and also an aluminium alloy (6082) using copper interlayers.